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Key Responsibilities
- Design and Development of mechanical proposals as per customer requirements together with R&D electrical engineer.
- Generate presentations for customer explaining mechanical design highlights.
- Attend project customer meeting when requested
- 3D/2D CAD deliverables: Create STEP 3D models and 2D drawings for Product Specification.
- Generate RM specification document and RM approval document.
- Supplier communication: Coordinate with suppliers to align design constraints, materials, tolerances, costs, and manufacturability.
- FEA simulation: Plan and execute finite‑element analysis (FEM) simulations for structural (mechanical) and thermal performance; interpret results and drive design decisions.
- Design validation: Support test plans for prototypes; review results to confirm requirements and standards compliance.
- Continuous improvement: Identify cost/weight/space optimizations, propose ECOs, and contribute to DFMEA/8D/5‑Why activities where applicable
- Others assigned R&D Director
- Reports to R&D Director and is responsible for the R&D Mechanical Engineers team
Education
- Bachelor’s Degree in Mechanical Engineering
Behavioural competences
- Highly proactive person, communicative , able to work with pression, innovative person
Professional and functional competences
- Strategic thought, High focus on result, transversality skills( able to work with multicultural team), team management, continuous improvements focus, self actualization of knowledge.
Experience requirements
- Over 7 years of professional experience in mechanical design of electronic components or electro‑mechanical assemblies, preferably in power‑electronics environments.
Language skills
- English language, good level written and speaking.
Software skills
- MS office user.
- CAD: Advanced user of SolidWorks and AutoCAD.
- FEM/Simulation: Experience with finite‑element analysis tools for mechanical (structural) and thermal simulations.
Additional skills
- Materials & processes: Practical knowledge of metals, polymers, thermal interface materials, insulation systems, tolerances, and common fabrication processes for electronic components.